Title:
HARD-SOFT BALL SORTING DEVICE
Document Type and Number:
Japanese Patent JP3160495
Kind Code:
B2
Abstract:
PURPOSE: To prevent the mixing-up of hard balls with soft ones by allowing these balls to bounce obliquely in the longitudinal direction, and sorting two types of balls through utilization of the distance difference in the longitudinal direction produced by the difference in bouncing height.
CONSTITUTION: A repellent hopping board 10 composed of an upper layer and a lower layer laminate and installed aslant under the ball drop position. The upper layer plate member is made of hard thin plate of steel, etc., while the lower layer plate member is made of a high elasticity material such as elastomer. The device is made movable in the longitudinal direction so as to comply with changing height of a conveyor, and its inclining angle is made adjustable so that it is practicable to change the bouncing angle in the relative positioning of the hopping board 10 with the ball release position of a ball supplying means 4. Therein a hard ball H follows a low parabolic locus (h) through action of the shock absorbing ability of the lower plate member having high elasticity, while a soft ball follows a high parabolic locus (s) through action of the high repulsive resilience of the lower plate member having high elasticity. Thereby two types of balls are assorted.
Inventors:
Saburo Horikawa
Application Number:
JP15828895A
Publication Date:
April 25, 2001
Filing Date:
May 31, 1995
Export Citation:
Assignee:
Kinki Cresco Co., Ltd.
International Classes:
A63B47/00; A63B47/02; B07B13/10; (IPC1-7): A63B47/00
Domestic Patent References:
| JP61112906A | ||||
| JP5685369A |
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)
Previous Patent: くびふり百発百中ハイブリッド印材
Next Patent: INTEGRATED CIRCUIT PACKAGE WITH DIAMOND-COOLING ELEMENT
Next Patent: INTEGRATED CIRCUIT PACKAGE WITH DIAMOND-COOLING ELEMENT