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Title:
HARD WORK CUTTING CIRCULAR SAW
Document Type and Number:
Japanese Patent JP62193775
Kind Code:
A
Abstract:

PURPOSE: To form such a cutting portion as being yet thinner without entailing any drop in strength of a disc and make width of cut as well as to strengthen binding capacity in making the binding area increase, by making the wall thickness of a cutting portion forming part thinner than that of the disc, and forming a step part there.

CONSTITUTION: A lot of holes 3 are set up in random form in a cutting portion forming part 2 having proper width toward the center of a disc 1 from an outer circumferential end of the disc 1. Diamond fine grains 4 are bonded overall on a surface of this cutting portion forming part 2 and each inner circumferential wall of these holes 3, forming a cutting portion of a circular saw. At this time, wall thickness of the cutting portion forming part 2 is made thinner than that of the disc 1 except the cutting portion forming part 2, and a step part 6 is formed whereby binding force to the cutting portion forming part 2 of the cutting portion 5 can be strengthened. Along with this, stress to be received by these diamond fine grains 4 in and around this step part 6 can be held up with this step part 6, and the cutting portion 5, namely, the circular saw's durability is improvable. In addition, the yet thinner cutting portion 5 is formable without entailing any drop in strength of the disc 1 and, what is more, the width of cut can be smaller.


Inventors:
Matsuda, Yusaku
Matsuda, Takatsugu
Application Number:
JP1986000034913
Publication Date:
August 25, 1987
Filing Date:
February 18, 1986
Export Citation:
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Assignee:
SANWA DAIYAMONDO KOGYO KK
International Classes:
B24D3/00; B24D5/12; (IPC1-7): B24D3/00; B24D5/12



 
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