Title:
Hardenability constituent
Document Type and Number:
Japanese Patent JP5907262
Kind Code:
B2
Abstract:
A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided.
Inventors:
Min Jin Ko
Mun Sun Mun
Jae Ho Jun
Bum Gyu Choi
De Ho Kang
Min Kyun Kim
Byun Kyu Cho
Mun Sun Mun
Jae Ho Jun
Bum Gyu Choi
De Ho Kang
Min Kyun Kim
Byun Kyu Cho
Application Number:
JP2014521572A
Publication Date:
April 26, 2016
Filing Date:
July 23, 2012
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08L83/07; C08K3/22; C08K3/36; C08L83/05
Domestic Patent References:
| JP2008231199A | ||||
| JP2012041496A | ||||
| JP2011256251A |
Foreign References:
| US20110140289 | ||||
| WO2011102272A1 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe