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Patent Searching and Data


Title:
Hardenability white resin composition
Document Type and Number:
Japanese Patent JP6095310
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable white insulating resin composition capable of attaining a cured film excellent in adhesion to a base material and superior in surface smoothness and solvent resistance.SOLUTION: The curable white insulating resin composition includes (A) a compound having no silyl group and having one or more (meth)acrylic groups in the molecule, (B) a photoinitiator, (C) a silane coupling agent having an ethylenic unsaturated bond, in an amount of 20-40 pts.mass to 100 pts.mass of the (A) component, and (D) titanium oxide, and is characterized in that the (A) component contains a compound having two or more (meth)acrylic groups in the molecule, in an amount of 50 wt.% or more.

Inventors:
Yusuke Taniguchi
Okamoto Yoshio
Application Number:
JP2012213478A
Publication Date:
March 15, 2017
Filing Date:
September 27, 2012
Export Citation:
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Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
C09D4/02; C08F2/44; C08F292/00; H05K1/03
Domestic Patent References:
JP2009197155A
JP2003015292A
JP2007115816A
JP2000356762A
JP2007034213A
JP2012212039A
JP2010117702A
JP63152604A
JP2002371236A
JP2011158628A
JP57131221A
JP2002356514A
JP2009173755A
JP2011132276A
JP5202146A
Foreign References:
US4221697
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Yasushi Miyagi