Hardened type adhesives - Mitsubishi Chemical Corporation

Title:

Hardened type adhesives

Document Type and Number:

Japanese Patent JP6269190

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a cure type adhesive consisting of an acrylic copolymer capable of adding high transparency and good property to adhesiveness, a flat panel display or a solar cell module using the cure type adhesive.SOLUTION: There is provided a cure type adhesive containing a polymerizable composition containing radical polymerizable polyether containing a polyalkylene ether skeleton having a (meth)acryloyl group represented by the formula (1) as a pendant and a polytetramethylene ether skeleton (A) of 1 to 99 mass%, a radical polymerizable vinyl-based monomer (B) of 99 to 1 mass% and a polymerization initiator (C).

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Inventors:

Kikuchi Saori
Hiroshi Shinna

Application Number:

JP2014046732A

Publication Date:

January 31, 2018

Filing Date:

March 10, 2014

Export Citation:

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Assignee:

Mitsubishi Chemical Corporation

International Classes:

C08F290/14; C09J171/00; C09J4/00

Domestic Patent References:

JP6163962B2
JP61192729A
JP42018344B1
JP10251602A
JP2000345010A

Foreign References:

WO2014126157A1

Other References:

Synthesis of Laterally Linked Poly(tetrahydrofuran)-Poly(methyl methacrylate) Block Copolymers via U,Macromolecules,米国,American Chemical Society,2007年 4月 4日,Vol.40,No.9,p.3183-3189

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