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Title:
Hardening resin constituent
Document Type and Number:
Japanese Patent JP6187010
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition capable of providing a pattern excellent in adhesion property to a substrate.SOLUTION: The curable resin composition contains a resin (A), a resin (B), a polymerizable compound (C), a polymerization initiator (D) and a solvent (E). The resin (A): a resin containing a structural unit derived from at least one kind selected from a group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a structural unit derived from a monomer having a cyclic ether structure having 2 to 4 carbon atoms and an ethylenically unsaturated bond and having an epoxy equivalent of 200 g/eq to 500 g/eq. The resin (B): a resin containing a structural unit derived from at least one kind selected from a group consisting of the unsaturated carboxylic acid and the unsaturated carboxylic acid anhydride, and a structural unit derived from the monomer having the cyclic ether structure having 2 to 4 carbon atoms and the ethylenically unsaturated bond and having the epoxy equivalent of 1,200 g/eq to 2,600 g/eq.

Inventors:
Katsuji Inoue
Yoichi Takahashi
Shirakawa Masakazu
Application Number:
JP2013164876A
Publication Date:
August 30, 2017
Filing Date:
August 08, 2013
Export Citation:
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Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08L63/00; C08K5/33; C08K5/3445; C08L101/06; G03F7/031; G03F7/032; H01L27/32
Domestic Patent References:
JP2009139932A
JP2012073604A
JP2012137745A
JP2012098711A
JP2001302870A
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto