Title:
PACKAGING METHOD OF DISPLAY DEVICE ONTO MOTHER BOARD AND PACKAGING STRUCTURE OF DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP3198332
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of contriving the facility of handling and complying with the request of making the device thin.
SOLUTION: In a structure packaging a display device 1; having a substrate 12, on which plural light sources are mounted and plural terminal parts 12c, 12d making currents flow through the respective light sources are formed on the end edge part, and a reflection case 13, joined to the substrate 12 and forming a window hole on the portion corresponding to the respective light sources; on a mother board 2, the reflection case 13 is housed in a through-hole 20 so that the displaying surface of a display device 1 faces the case from the through-hole 20 formed in the mother board 2. Preferably, a device in which at least a part of the substrate 12 is stuck out of the peripheral edge of the reflection case 13 is used for the display device 1 and the stuck out part 12D is engaged with the peripheral edge of the through-hole 20 of the mother board 2.
Inventors:
Takehiro Fujii
Application Number:
JP34596397A
Publication Date:
August 13, 2001
Filing Date:
December 16, 1997
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
G09F9/00; G09F9/302; H05K1/18; H01L33/00; (IPC1-7): G09F9/00; H01L33/00
Domestic Patent References:
| JP62139388A | ||||
| JP6301342A | ||||
| JP5667883A | ||||
| JP832106A | ||||
| JP51117894A | ||||
| JP4367891A | ||||
| JP5845521U | ||||
| JP373979U |
Attorney, Agent or Firm:
Minoru Yoshida (2 outside)