Title:
HEAT CONDUCTING PLATE, MANUFACTURING METHOD OF THE PLATE, HEAT SINK ASSEMBLY, AND MANUFACTURING METHOD OF THE ASSEMBLY
Document Type and Number:
Japanese Patent JP3674552
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide heat conducting plates, a heat sink assembly, and the manufacturing methods thereof which are easy to carry out, and further, the detachments of the individual thermally conducting plate and heat sink can be made easily.
SOLUTION: Heat conducting plates 21 are provided in an electronic- component mounting apparatus, having mounted electronic components, after they have been created by punching with a punching press a plate 10 which is superior in thermal conductivity, they are further returned to be engaged to the punched portions of the plate 10.
Inventors:
Mori Masahiro
Hiroi Atsushi
Hiroi Atsushi
Application Number:
JP2001238916A
Publication Date:
July 20, 2005
Filing Date:
June 07, 1993
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L23/36; (IPC1-7): H01L23/36
Domestic Patent References:
| JP2148853A | ||||
| JP3099444U | ||||
| JP2039459A | ||||
| JP4096290A | ||||
| JP4164383A | ||||
| JP3236267A | ||||
| JP4116963A |
Attorney, Agent or Firm:
Takenori Hiroe
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