Title:
熱伝導シリンダー
Document Type and Number:
Japanese Patent JP5777321
Kind Code:
B2
Abstract:
The present invention relates to a thermal conductive cylinder (300) installed with U-type core piping and loop piping (100) for being installed within the natural thermal storage body (500) or artifical thermal storage body (500); wherein the piping segments of fluid inlet terminal and/or outlet terminal (101,102) of the U-type core piping (100) and loop piping are directly made of thermal insulating material (400), or thermal insulating structure is installed between the inlet terminal and the outlet terminal; so as to prevent thermal energy loss between adjacent piping segments on the same side when thermal conductive fluid with temperature difference passing through.
Inventors:
Yasukazu Yang
Application Number:
JP2010242197A
Publication Date:
September 09, 2015
Filing Date:
October 28, 2010
Export Citation:
Assignee:
Yasukazu Yang
International Classes:
F28D1/047; F24V50/00; F28D7/10; F28D20/00; F28D21/00
Domestic Patent References:
| JP57058043A | ||||
| JP2005337590A | ||||
| JP2001174073A | ||||
| JP2006118851A |
Foreign References:
| US5623986 |
Attorney, Agent or Firm:
Masaki Hattori