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Title:
HEAT CONDUCTION INSULATION DEVICE
Document Type and Number:
Japanese Patent JP2006090494
Kind Code:
A
Abstract:

To provide a heat conduction insulation device capable of being thin in thickness while maintaining an airtight property and maintaining vacuum conditions without welding.

The heat conduction insulation device is provided with an induction heater (heat source) 2 generating heat, and a vacuum insulation material 1 adjacent to the induction heater (heat source), and a surface layer of an outer cover material keeping into contact with the induction heater 2 in the vacuum insulation material 1 is set to be a sheet of metallic foil. The heat conduction insulation device can become thin in thickness while maintaining an airtight property of an insulative container, and maintains vacuum conditions without welding. when heat can be transmitted from the heat source by the metallic foil with a highly heat-conductive property and a high temperature section is locally existed on the induction heater (heat source) 2, heat locally existed on the high temperature section is lowered so that the heat locally existed on the high temperature section is diffused to a direction perpendicular to a widthwise direction of the vacuum insulation material 1. Deterioration of the outer cover material (gas-barrier natured) of the vacuum insulation material 1 caused by the heat locally existed on the high temperature section can be restrained, and consequently, temperature of a surface of the vacuum insulation material 1 at an opposite heat source side can be lowered.


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Inventors:
KOBAYASHI TOSHIO
Application Number:
JP2004278964A
Publication Date:
April 06, 2006
Filing Date:
September 27, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F16L59/06; H05B6/02
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito



 
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