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Title:
HEAT CONDUCTIVE CERAMIX FIXING APPARATUS
Document Type and Number:
Japanese Patent JPS53122651
Kind Code:
A
Abstract:
Copper backings brazed to ceramic parts exposed to high-temperature oxidizing high-velocity gases must be secured, for mounting purposes, to water-cooled fixed support, with high thermal conductance between backing and support. Prior art practice of brazing backing to support is inconvenient, making subsequent removal difficult, and disadvantageous in requiring that support be heated to brazing temperature (which may weaken support by annealing it). Invention teaches channel-shaped clip, on back of backing, whose legs are spread slightly to be inserted in mating slots in support face. All mating surfaces are tinned with lead-tin eutectic solder. If mere mechanical contact provides adequate thermal conductance between backing and support, solder remains unmelted; but if mechanical contact is imperfect temperature of backing will rise, and solder will melt and bridge gap between backing and support, raising thermal conductance.

Inventors:
MAIKERU JIYON NUUN
Application Number:
JP2606878A
Publication Date:
October 26, 1978
Filing Date:
March 09, 1978
Export Citation:
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Assignee:
GEN ELECTRIC
International Classes:
B23K31/02; B23K33/00; H02K44/10; C04B37/02; (IPC1-7): B23K1/12; C04B37/02; H02N4/02



 
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