Title:
HEAT-CONDUCTIVE AND MICROWAVE-ACTIVE MOLD FOR FOOD
Document Type and Number:
Japanese Patent JP2006144006
Kind Code:
A
Abstract:
To provide a useful mold which is used for foods and exhibits high flexibility, good adhesion resistance, reduced material adhesiveness or abrasion resistance, good food-purifying property, high heat conductivity, and good microwave activity in an ordinarily used frequency range.
A treated silicone, an untreated silicone, or a mixture of the treated silicone with the untreated silicone is mixed with a heat-conductive, microwave-active, or heat-conductive and microwave-active filler.
Inventors:
WEIDINGER JUERGEN
Application Number:
JP2005319963A
Publication Date:
June 08, 2006
Filing Date:
November 02, 2005
Export Citation:
Assignee:
WACKER CHEMIE AG
International Classes:
C08L83/04; A21B3/13; A47J27/00; A47J36/02; C08K3/22
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
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