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Title:
HEAT CONDUCTIVE SHEET AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2001168246
Kind Code:
A
Abstract:

To provide a flexible heat conductive sheet which can follow also to special forms, such as roughnesses and a curved surface, consequently can guarantee a high adhesion and at the same time, can guarantee excellent heat dissipation characteristics, and furthermore does not generate wrinkles, breaks or a stretch in the sheet even though the thickness of the sheet is reduced and is excellent also in a processability and a pasting workability at the formation of the sheet.

This heat conductive sheet is a heat conductive sheet comprising a base material and a heat conductive resin layer provided on at least one surface of the base material, and the sheet is constituted in such a method that the above resin layer is formed containing a binder resin and heat conductive filling materials made to disperse into the binder resin.


Inventors:
OKADA MICHIHIKO
UCHIYA TOMOAKI
Application Number:
JP34013899A
Publication Date:
June 22, 2001
Filing Date:
November 30, 1999
Export Citation:
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Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
H05K7/20; B32B27/20; H01L23/36; H01L23/373; (IPC1-7): H01L23/36; B32B27/20
Domestic Patent References:
JPH05198709A1993-08-06
JPH02196453A1990-08-03
JPS57163548A1982-10-07
JPH0714950A1995-01-17
JPH10183110A1998-07-14
JPH06155517A1994-06-03
Attorney, Agent or Firm:
Takashi Ishida (4 others)