Title:
HEAT-CONDUCTIVE SHEET AND MANUFACTURING METHOD OF HEAT-CONDUCTIVE SHEET
Document Type and Number:
Japanese Patent JP2023120623
Kind Code:
A
Abstract:
To provide a heat-conductive sheet excellent in thermal conductivity in a thickness direction by setting filler in high orientation, while being low density.SOLUTION: A heat-conductive sheet includes heat-conductive filler (B) containing at least one kind of carbon and boron nitride in a polymer matrix (A). In the heat-conductive sheet, a coefficient of thermal conductivity in a thickness direction is 15 W/m K or more. A degree of orientation of a longitudinal direction of the heat-conductive filler oriented is 1.0 or more with regard to the thickness direction of the heat-conductive sheet.SELECTED DRAWING: Figure 1
Inventors:
IMAIZUMI KEIJI
TSUKADA JUNICHI
TSUKADA JUNICHI
Application Number:
JP2022023573A
Publication Date:
August 30, 2023
Filing Date:
February 18, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08J5/18; B29D7/01; C08K3/04; C08K3/38; C08L101/00; H01L23/36
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toru Otsuka
Toshihiro Kobayashi
Toru Otsuka
Previous Patent: Film forming method and film forming apparatus
Next Patent: Information processing device and information processing method
Next Patent: Information processing device and information processing method