Title:
加熱硬化型導電性ペースト組成物
Document Type and Number:
Japanese Patent JP5651625
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting conductive paste composition capable of reducing the specific resistance of an electrode, wire or the like to be formed and further minimizing the contact resistance thereof with another conductor.SOLUTION: A conductive paste composition contains, as thermosetting components, an epoxy resin (component A) having a cyclic structure which has an epoxy equivalent in the range of 160-400 and a viscosity (25°C) in the range of 3,000-55,000 mPa s; an epoxy resin (component B) having a cyclic structure, which has an epoxy equivalent in the range of 140-300 and a viscosity (25°C) in the range of 30-3,000 mPa s; and a solid resin (component C) obtained by polymerization using bisphenol and epichlorohydrin, these components being blended in a predetermined ratio. The ratio of conductive powders in the solid content is in the range of 90-98 mass%, and the composition has a paste viscosity (25°C) in the range of 200-500 Pa s.
Inventors:
尾木 孝造
岡野 卓
新井 貴光
中山 豊
岡野 卓
新井 貴光
中山 豊
Application Number:
JP2012063846A
Publication Date:
January 14, 2015
Filing Date:
March 21, 2012
Export Citation:
Assignee:
京都エレックス株式会社
International Classes:
C08L63/00; B22F1/00; B22F1/02; B22F9/00; C08K3/00; H01B1/00; H01B1/22; H01L31/04; H05K1/09
Attorney, Agent or Firm:
Patent business corporation Owner old patent firm