To provide a heat-curable resin composition having a high dielectric constant and a low dielectric dissipation factor, having excellent processability, adhesion, heat resistance, etc., and suitably used as an integrated circuit board, condenser, cellular phone, ITS, GPS, antenna, wireless LAN, high-frequency circuit board, high-speed connector, etc., to provide a resin solution, to provide a resin sheet, and to provide a metal foil laminated product.
This heat-curable resin composition contains (A) at least one kind of polyimide resin, (B) a heat-curable resin, and (C) an inorganic oxide, wherein the polyimide resin (A) is obtained by reacting a specified acid dianhydride component, such as 4, 4'-(4, 4'-isopropylidenediphenoxy)bisphthalic acid anhydride, with a diamine component, and the inorganic oxide (C) has the dielectric constant of ≥ 5 at 1GHz and the dielectric dissipation factor of ≤ 0.02 at 1GHz.
TANAKA SHIGERU
SHIMOOOSAKO KANJI
NISHINAKA MASARU
ITO TAKU
Kei Saki
Fumio Akiyama
Hiromu Tanaka