To provide a heat-curable resin composition of which tensile strength and elongation characteristics can be arbitrarily adjusted, while retaining favorable heat resistance and excellent storage stability.
A heat-curable resin composition contains (A) an epoxy resin, (B) a resin having a carbonate backbone and a urethane bond within its molecular chain, (C) a polyfunctional phenolic resin, (D) a polyethylene resin, and (E) an amine compound. Component (B) is preferably a resin having a structural unit expressed by general formula (I). (In general formula (I), the plurality of R each independently represent an alkylene group having 1 to 18 carbon atoms, the plurality of X each independently represent an alkylene group or an arylene group having 1 to 18 carbon atoms, m and n each independently represent an integer of 1 to 20, and Y represents a trivalent organic group.).
KANEKO SUSUMU
HIRATA TOMOHIRO
