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Title:
HEAT-CURING EPOXY RESIN COMPOSITION CONTAINING NON-AROMATIC UREA AS ACCELERANT
Document Type and Number:
Japanese Patent JP2016138273
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-curing epoxy resin composition having excellent storage stability at room temperature, exhibiting rapid curing at 160 to 170°C and particularly having high impact resistance.SOLUTION: A one-component type heat-curing epoxy resin composition for body-shell adhesive in a vehicle structure is provided that contains a) at least one epoxy resin A having more than 1 epoxide group per molecule (thereafter A) of 15 to 60 mass% of the total mass of the composition, b) at least one epoxy resin hardener B which is amine, amide, carboxylic acid anhydride or polyphenol of 0.2 to 10 mass% based on the mass of A, c) an accelerant C which is 1,1-dimethyl urea of 0.02 to 2.0 mass% based on the mass of A, d) at least one toughness improver D of 0.1 to 50 mass% of the total mass of the composition, the D being selected from block polyurethane polymers, liquid rubbers, epoxy resin modification liquid rubbers or core-shell polymers.SELECTED DRAWING: None

Inventors:
KRAMER ANDREAS
FINTER JUERGEN
KARSTEN FRICK
RHEINEGGER URS
SCHULENBURG JAN OLAF
Application Number:
JP2016020733A
Publication Date:
August 04, 2016
Filing Date:
February 05, 2016
Export Citation:
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Assignee:
SIKA TECH AG
International Classes:
C09J163/00; C08G59/40; C09J5/06; C09J11/06; C09J11/08
Domestic Patent References:
JPS5426000A1979-02-27
JPH05148337A1993-06-15
JP2007504341A2007-03-01
JP2006509879A2006-03-23
JPS5634723A1981-04-07
JPS6487667A1989-03-31
JPS4993495A1974-09-05
JP2007521377A2007-08-02
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe