To provide a heat dissipating device capable of achieving an excellent heat-dissipating effect efficiently.

The heat-dissipating device is provided with a thermal superconductor (4), a fan unit (7), and a conduit(6). The thermal superconductor (4) is provided with a hollow heat transfer body (40) that is arranged in a heat releasing component (5) of an electronic device. The hollow heat transfer body (40) comprises a heat conducting material, and it is constituted in such a manner as to define at least one air flow path (44). The fan unit (7) is arranged to exhaust high temperature air from the heat transfer body (40).The conduit (6) has an intake port (61) which communicates with the heat transfer body (40) to collect high-temperature air from the heat transfer body (40), an exhaust port (62) which communicates with the fan unit (7), and an intermediate conduit portion (62) interconnecting the intake and exhaust ports (61 and 63) so as to guide the high temperature air to the exhaust port (63) from the intake port (61) and exhaust it by the fan unit (7).