PURPOSE: To protect a semiconductor chip thermally and effectively by composing a block-shaped heat-dissipating member used by fixation to the semiconductor chip of an excellent heat-conductive material and forming a projecting section projected from a surface on the reverse side to a surface fastened to the semiconductor chip to the surface on the reverse side.
CONSTITUTION: Since a heat-dissipating block 2 consisting of a material having large heat conductivity is fixed to a semiconductor chip 1, most of the heat generated at the time of the operation of the semiconductor chip 1 is transmitted over the heat- dissipating block 2. The heat is dissipated into air by the projecting section 21 of the heat-dissipating block 2 exposed from a resin mold 3. When the projecting section 21 of the heat-dissipating block 2 is fastened so as to be fast stuck to the ground pad 52 of a wiring board 5 at that time, a more effective heat-conductive effect is acquired in addition to heat dissipation into air by the projecting section 21. That is, since the ground pad 52 composed of a copper foil, etc., has large heat conductivity, heat transmitted over the heat-dissipating block 2 from the semiconductor chip 1 is transmitted effectively over the ground pad 52, and dissipated efficiently to the wiring board 5 having a large area.
YAMAMOTO TOSHIO
OZEKI YOSHIO
KAMIYA MITSUMASA
