Title:
HEAT-DISSIPATING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2021050327
Kind Code:
A
Abstract:
To provide a resin molding having excellent heat-dissipating properties and a heat-dissipating resin composition that can form the resin molding, and provide a resin composition for power devices, a resin composition for electromagnetic wave shielding, a resin composition for heat-dissipating resin substrates and a resin composition for sealing material each of which exhibits excellent heat-dissipating properties.SOLUTION: A heat-dissipating resin composition contains modified cellulose and resin. Preferably the heat-dissipating resin composition further contains inorganic particles.SELECTED DRAWING: None
Inventors:
YAMATO KYOHEI
YOSHIDA MINORU
YOSHIDA MINORU
Application Number:
JP2020141743A
Publication Date:
April 01, 2021
Filing Date:
August 25, 2020
Export Citation:
Assignee:
KAO CORP
International Classes:
C08L1/02; C08K3/013; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Yoshinori Hosoda
Yoshihiro Hosoda
Yoshihiro Hosoda