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Title:
HEAT DISSIPATING STRUCTURE AND MANUFACTURING METHOD OF ELECTRIC APPARATUS
Document Type and Number:
Japanese Patent JP2009070981
Kind Code:
A
Abstract:

To transmit heat generated from a circuit element 27 to a radiator, and to efficiently diffuse it without giving unnecessary stress to a flexible wiring member 23 mounted with the circuit element 27.

The circuit element 27 arranged in the flexible wiring member 23 is stored in a recess 48 of a dissipation coupler 45 having turnable spindles 45a at both ends, and the dissipation coupler 45 is fixed to the wiring member 23. A pair of support pieces 45a of the radiator 44 having a dissipation part 44b, which is positioned outside the side wall 3a of a head holder 3 are made to face the inside of the head holder 3. Bearings 46 disposed in the pair of support pieces 45a support the turnable spindles 45a of the dissipation coupler 45 so as to be turnable. Since the dissipation coupler 45 is fitted along a pull angle of the flexible wiring member 23 extending from a discharge head 4 to a circuit board 30, unnecessary stress is not given to the flexible wiring member 23.


Inventors:
IMAI KOJI
Application Number:
JP2007236890A
Publication Date:
April 02, 2009
Filing Date:
September 12, 2007
Export Citation:
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Assignee:
BROTHER IND LTD
International Classes:
H05K7/20; B41J29/00
Attorney, Agent or Firm:
Akio Ishii
Tadashi Higashino
Hiroyuki Nishi