Title:
電子部品の放熱装置
Document Type and Number:
Japanese Patent JP4157871
Kind Code:
B2
Abstract:
A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.
Inventors:
Hironobu Tanaka
Yoshiyuki Sato
High No Wataru
Hideki Senya
Mitsuaki Hayashi
Kazuya Nishida
Katsuhiko Ikeda
Yoshiyuki Sato
High No Wataru
Hideki Senya
Mitsuaki Hayashi
Kazuya Nishida
Katsuhiko Ikeda
Application Number:
JP2004564454A
Publication Date:
October 01, 2008
Filing Date:
December 27, 2002
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L23/40; H05K7/20
Domestic Patent References:
| JP4284654A | ||||
| JP9298259A |
Attorney, Agent or Firm:
Tadahiko Ito