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Title:
HEAT DISSIPATION DEVICE FOR LED LIGHTING
Document Type and Number:
Japanese Patent JP2014078441
Kind Code:
A
Abstract:

To provide a heat dissipation device for LED lighting that can obtain sufficient heat dissipation performance.

A heat dissipation device 3 for LED lighting comprises: a heat pipe 7 having a heat receiving part 8 that receives heat generated by LEDs; and heat dissipation fins 9 provided integrally with the heat pipe 7. A hydraulic fluid sealing part 13 of a container 12 of the heat pipe 7 comprises: a plurality of hydraulic fluid flowing parts 14 extending vertically; and at least one lower header part 19 that connects lower end parts of the plurality of hydraulic fluid flowing parts 14. The heat receiving part 8 that receives heat generated by LEDs is provided on an external surface of a lower wall 19a of the lower header part 19. Heat transfer fins 38 that transfer heat received by the heat receiving part 8 to hydraulic fluid in the lower header part 19 are provided on an internal surface of the lower wall 19a of the lower header part 19.


Inventors:
SASAKI HIRONAKA
TAGA KAZUO
Application Number:
JP2012226111A
Publication Date:
May 01, 2014
Filing Date:
October 11, 2012
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
F21V29/00; F21S2/00; F28D15/02; H01L33/64; F21Y101/02
Attorney, Agent or Firm:
Akira Watanabe
Einosuke Kishimoto
Matsumura Naoto