Title:
HEAT DISSIPATION DEVICE
Document Type and Number:
Japanese Patent JP2022111132
Kind Code:
A
Abstract:
To provide a heat dissipation device for which high heat dissipation can be achieved.SOLUTION: The heat dissipation device includes a heat generating body, a heat dissipating body, and a heat conductive sheet sandwiched between the heat generating body and the heat dissipating body. The heat conductive sheet has a thermal conductivity of 15 W/m K or more in the direction of the thicknesses. The area of the surface of the heat conductive sheet sandwiched is smaller than the area of the surface to which the heat generating body and the heat dissipating body are adhered. The ratio of the area of the sandwiched surface of the heat conductive sheet to the area of the adherend surface of the heat generating body and heat dissipating body is 10% or more and 40% or less.SELECTED DRAWING: None
Inventors:
KOBAYASHI HAJIME
MURAKAMI YASUYUKI
UTSUMI DAISUKE
MURAKAMI YASUYUKI
UTSUMI DAISUKE
Application Number:
JP2022079788A
Publication Date:
July 29, 2022
Filing Date:
May 13, 2022
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
H01L23/36; C08J5/18; H01L23/373; H05K7/20
Domestic Patent References:
| JP2017028040A | 2017-02-02 | |||
| JP2010132856A | 2010-06-17 | |||
| JP2011162642A | 2011-08-25 |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yuta Terashima
Noboru Hiro
Mitsutsugu Sugimura
Yuta Terashima
Noboru Hiro
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