Title:
HEAT RADIATOR AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2023140044
Kind Code:
A
Abstract:
To prevent increase in size and surface temperature while improving heat dissipation performance.SOLUTION: A heat radiator 10 includes a heat dissipation structure 1 consisting of a first member 1A and a second member 1B having higher thermal conductivity than the first member 1A, and a cavity 2 provided in the heat dissipation structure 1 and penetrating the heat dissipation structure 1, and the second member 1B has at least two surfaces in contact with the first member 1A, the first surface 1BBb of the two surfaces of the second member 1B is external, and the second surface 1BAc is in the cavity 2.SELECTED DRAWING: Figure 2
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Inventors:
EBARA TAKUMA
ODAKA NORIHISA
YAMAGUCHI ATSUKO
KOZAI DAISUKE
ODAKA NORIHISA
YAMAGUCHI ATSUKO
KOZAI DAISUKE
Application Number:
JP2022045883A
Publication Date:
October 04, 2023
Filing Date:
March 22, 2022
Export Citation:
Assignee:
JVC KENWOOD CORP
International Classes:
H05K7/20; H01L23/36; H01L23/467
Attorney, Agent or Firm:
Sakai International Patent Office