Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
放熱材
Document Type and Number:
Japanese Patent JP6470539
Kind Code:
B2
More Like This:
JP6022061The manufacturing method of a thermosetting resin composition and a thermally conductive sheet, and a power module
WO/2021/064992HEAT PUMP DEVICE AND ELECTRICAL DEVICE
WO/2011/019719FULLY-CURED THERMALLY OR ELECTRICALLY-CONDUCTIVE FORM-IN-PLACE GAP FILLER
Inventors:
Chung-Yun Hse
Hiroyuki Hayashi
Application Number:
JP2014208678A
Publication Date:
February 13, 2019
Filing Date:
October 10, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Kri Co., Ltd.
International Classes:
C09K5/14; C08K3/14; C08K3/22; C08K3/28; C08K3/34; C08K3/38; C08L1/00; C09D5/00; C09D7/61; C09D101/00; H01L23/373; H05K7/20
Domestic Patent References:
JP2007051266A
JP2012007247A
JP2013091874A
JP2012167192A



 
Previous Patent: 配線構造

Next Patent: MIXTURE OF CHLOROPRENE POLYMER AND PRODUCTION THEREOF