Title:
HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE
Document Type and Number:
Japanese Patent JP2023142139
Kind Code:
A
Abstract:
To provide a heat dissipation member that ensures cooling performance while taking measures against contamination.SOLUTION: A heat dissipation member 5 includes a plate-shaped base portion 2 that extends in a first direction along the direction in which a refrigerant flows and in a second direction perpendicular to the first direction, and has a thickness in a third direction perpendicular to the first direction and the second direction, and a plurality of fins 10 protruding from the base portion 2 to one side in the third direction and arranged in the second direction. When the downstream side through which the refrigerant flows is defined as one side in the first direction, the fin 10 has a flat plate-shaped side wall portion 11 that extends in the first direction and the third direction and has a thickness in the second direction. The side wall portion 11 includes a slit penetrating in the second direction, and a bent portion 11A that is arranged on at least either one side of the slit in the first direction or the other side of the slit in the first direction and is bent in the second direction. The length of the bent portion 11A is shorter than the length in the first direction between a first direction end of the slit that faces the bent portion 11A and a bending start position of the bent portion.SELECTED DRAWING: Figure 1
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Inventors:
MURAKAMI KOJI
YANAGITA YUKI
YANAGITA YUKI
Application Number:
JP2022048856A
Publication Date:
October 05, 2023
Filing Date:
March 24, 2022
Export Citation:
Assignee:
NIDEC CORP
International Classes:
H01L23/473; H05K7/20
Attorney, Agent or Firm:
Patent Attorney Corporation Sano Patent Office