Title:
放熱板材
Document Type and Number:
Japanese Patent JP6786090
Kind Code:
B2
Abstract:
A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
More Like This:
| JPH05315776 | COOLING STRUCTURE FOR PARTS OF SURFACE INSTALLATION |
| JP4283588 | Semiconductor device |
| WO/2005/045928 | DC-DC CONVERTER IMPLEMENTED IN A LAND GRID ARRAY PACKAGE |
Inventors:
Cho, Myung-fan
Kim, Il-ho
Lee, Suk-u
Kim, Yong-Suk
Hiroto Narie
Tomoaki Aoyama
Kim, Il-ho
Lee, Suk-u
Kim, Yong-Suk
Hiroto Narie
Tomoaki Aoyama
Application Number:
JP2020009092A
Publication Date:
November 18, 2020
Filing Date:
January 23, 2020
Export Citation:
Assignee:
The Good System Corporation
DOWA Metal Tech Co., Ltd.
DOWA Metal Tech Co., Ltd.
International Classes:
H01L23/36; C22C9/00; C22C14/00; C22C25/00; C22C27/04; C22C27/06
Domestic Patent References:
| JP2019104021A | ||||
| JP2019502251A | ||||
| JP2016127197A | ||||
| JP2011014917A | ||||
| JP2016168687A |
Foreign References:
| KR1020180097021A | ||||
| WO2010027052A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark