Title:
HEAT DISSIPATION SHEET, HEAT DISSIPATION DEVICE, AND METHOD OF MANUFACTURING HEAT DISSIPATION SHEET
Document Type and Number:
Japanese Patent JP2010040883
Kind Code:
A
Abstract:
To provide a sheet-shape heat dissipation structure exhibiting insulation, having high heat conductivity, and excelling in heat transporting capability.
The heat dissipation sheet has at least a sheet-shape structure as a base material. On at least one surface of the base material, a BN layer composed of a hexagonal boron nitride (hBN) is provided. Preferably, the BN layer is formed of a BN sheet, and the ab plane of the hBN crystal forming the BN sheet is parallel with the sheet plane.
Inventors:
KAWAI CHIHIRO
Application Number:
JP2008203700A
Publication Date:
February 18, 2010
Filing Date:
August 07, 2008
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/373; B32B9/00; C01B21/064; C01B31/04
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Jun Komatsu
Norio Kagami
Jun Komatsu
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