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Title:
HEAT DISSIPATION SHEET AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
Japanese Patent JP2007012913
Kind Code:
A
Abstract:

To provide a heat dissipation sheet which is more preferably usable in the use of dissipating heat generated from a heat generating object, and a heat dissipation structure provided with the heat dissipation sheet.

The heat dissipation structure 11 is provided with the heat dissipation sheet 21, a case 12 and the heat generating object 13. The heat dissipation sheet 21 is provided with a graphite sheet 22 and an elastic layer 23 having electric insulation to be provided on the surface 22a of thereof. The average thickness of the graphite sheet 22 is not more than 300 μm. The elastic layer 23 is formed of an elastic composition containing a particle-like thermal conductive filler. The average thickness of the elastic layer 23 is 10-280 μm. The average grain size of the thermal conductive filler is not more than 50% of the average thickness of the elastic layer 23. In the elastic composition, the content of the thermal conductive filler is not less than 30 vol.%, and the content of the thermal conductive filler having the average grain size of not less than 95% of the average thickness of the elastic layer 23 is less than 15 vol.%. The volume of a free space 12a in the case 12 is less than 20% of the capacity of the case 12.


Inventors:
OTA MITSURU
YAMAZAKI JUN
FUJIWARA KIKUO
Application Number:
JP2005192438A
Publication Date:
January 18, 2007
Filing Date:
June 30, 2005
Export Citation:
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Assignee:
POLYMATECH CO LTD
OTSUKA DENKI KK
International Classes:
H01L23/373; B32B9/00; H05K7/20
Domestic Patent References:
JP2003158393A2003-05-30
JP2004023065A2004-01-22
JP2001287298A2001-10-16
JP2003253136A2003-09-10
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda