Title:
HEAT DISSIPATION STRUCTURE
Document Type and Number:
Japanese Patent JP2022047322
Kind Code:
A
Abstract:
To provide a heat dissipation structure having high insulating properties.SOLUTION: A heat dissipation structure comprises: a substrate to which heating elements are attached; a resin layer that is provided between the substrate and a heat dissipation member and attached to the substrate; and heat transfer units that transfer heat generated in the heating elements to the heat dissipation member through the resin layer. The heat transfer units each have a plate-like heat transfer member that is provided between the substrate and the resin layer and extends along the substrate, and a conductive layer that is provided between the substrate and the resin layer and over the substrate and the heat transfer member and partially arranged between the heat transfer member and the resin layer.SELECTED DRAWING: Figure 3
Inventors:
MISHIMA JUNYA
HAKATA TOMOYUKI
HAKATA TOMOYUKI
Application Number:
JP2020153167A
Publication Date:
March 24, 2022
Filing Date:
September 11, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H01L23/36; H05K7/20
Attorney, Agent or Firm:
Takuji Yamada
Hidehiro Tokuyama
Mitsuo Wada
Nobunori Iwaki
Hidehiro Tokuyama
Mitsuo Wada
Nobunori Iwaki