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Title:
HEAT EXCHANGE DEVICE
Document Type and Number:
Japanese Patent JP2017116122
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat exchange device in which a heat transfer coefficient on a refrigerant side and a heat transfer coefficient on a liquid side such as water have been improved, and to provide a heat exchange device which includes compactness and maintainability.SOLUTION: A heat exchange device 1 includes: an air-cooled heat exchanger 10 for performing heat exchange between a refrigerant and air; and water heat exchangers 20A, 20B for performing heat exchange between the refrigerant and water. Also, expansion valves 45A, 45B for expanding the refrigerant compressed by a compressor 41 are provided at the water heat exchangers 20A, 20B respectively. In the water heat exchangers 20A, 20B, the refrigerant flows in parallel and the water flows in series. Then, the heat exchange device 1 is divided into two housings and accommodated.SELECTED DRAWING: Figure 1

Inventors:
KOUDA KIMIO
AKIZUKI TAKAHIRO
SHIMOTAHIRA NAGAKAZU
SUN HONG ZHI
TAJIMA KAZUSHIGE
Application Number:
JP2015248764A
Publication Date:
June 29, 2017
Filing Date:
December 21, 2015
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
F25B1/00; F24F5/00; F25B5/02; F25B39/02
Domestic Patent References:
JP2002048359A2002-02-15
JPH0285654A1990-03-27
JP2014169830A2014-09-18
JP2011214730A2011-10-27
JPH04203854A1992-07-24
JPH11142024A1999-05-28
Foreign References:
WO2013046725A12013-04-04
Attorney, Agent or Firm:
Jiro Kobe
Takefusa Kubo
Fumio Ogata
Takehiko Sunada