To provide a heat exchanger allowing solder to easily enter into a space between passages in which fluid to be heat-exchanged is allowed to flow in assembling based on an ultrasonic soldering method.
A heat exchanger 10 is configured by alternately laminating water pipes 20 in which water is allowed to flow and refrigerant pipes 40 in which refrigerant is allowed to flow to perform heat exchange between water and the refrigerant. Each of the water pipes 20 includes water passage surfaces 22 and a plurality of water passage surface projections 23. The water passage surfaces 22 are joined to the refrigerant pipes 40. The water passage surface projections 23 are formed on the water passage surfaces 22 and projected to the refrigerant pipes 40. The water pipes 20 and the refrigerant pipes 40 are joined to each other by solder entered into inter-passage gaps 70. Each of the inter-passage gaps 70 is a gap formed by the water passage surface projections 23 between the water pipe 20 and the refrigerant pipe 40.
OTA SHOGO
AKAI KANJI
KIKUNO TOMOKAZU
YOSHIOKA TAKASHI
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