Title:
熱交換器、熱交換モジュール、および冷凍サイクル装置
Document Type and Number:
Japanese Patent JP6963098
Kind Code:
B2
Abstract:
The present invention provides: a heat exchanger in which a refrigerant can be more uniformly distributed to a plurality of heat exchange pipes; a heat exchange module; and an air conditioner. A heat exchanger (31) is provided with: a pair of header pipes (32), (33) arranged substantially in parallel; a plurality of flat pipes (35) which are arranged in the extension direction of the pair of header pipes (32), (33) and installed between the pair of header pipes (32), (33), and which circulate a refrigerant between the upstream-side header pipe (32) and the downstream-side header pipe (33); and an upstream-side connector (37) that delivers the refrigerant into the upstream-side header pipe (32). The upstream-side connector (37) has: a distal end opening (45) provided at the distal end thereof; and at least one lateral opening (46) provided on a side surface of the upstream-side connector (37) and facing an inner surface (32c) of the upstream-side header pipe (32). The angle θ formed between an opening direction (Z2) of the lateral opening (46) of the upstream-side connector (37) and a line segment L perpendicular to the header pipe is smaller than 45 degrees. The opening area of the lateral opening (46) is less than the opening area of the distal end opening (45).
Inventors:
Ayumi Onodera
Takashi Hatada
Takayama Tsukasa
Ryosuke Korezawa
Takashi Hatada
Takayama Tsukasa
Ryosuke Korezawa
Application Number:
JP2020510218A
Publication Date:
November 05, 2021
Filing Date:
March 27, 2018
Export Citation:
Assignee:
Toshiba Carrier Co., Ltd.
International Classes:
F25B41/42; F25B39/02; F28D1/053; F28F9/02; F28F9/22
Domestic Patent References:
| JP2016183847A | ||||
| JP11132598A | ||||
| JP2000292077A |
Foreign References:
| US20080190134 | ||||
| US20100037652 | ||||
| WO2018055826A1 |
Attorney, Agent or Firm:
Patent business corporation Tokyo International Patent Office