Title:
HEAT EXPANDABLE MICROSPHERE, MANUFACTURING METHOD AND USE THEREOF
Document Type and Number:
Japanese Patent JP2014080616
Kind Code:
A
Abstract:
To provide a heat expandable microsphere excellent in heat resistance and high in expansion ratio and exhibiting stable expansion behavior.
There is provided a heat expandable microsphere of which outer shell containing a foaming agent is obtained by forming a copolymer having a polymethacrylimide structure from a mixture of polymerizable monomers containing a nitrile-based monomer containing methacrylonitrile (excluding one containing methacrylonitrile of 50 wt.% or less in the nitrile-based monomer) and a monomer having a carboxyl group containing methacrylic acid, and which has a b* value after heating at 240°C for 2 minutes of 100 or less.
Inventors:
EJIRI TETSUO
Application Number:
JP2013246989A
Publication Date:
May 08, 2014
Filing Date:
November 29, 2013
Export Citation:
Assignee:
KUREHA CORP
International Classes:
C09K3/00; B01J13/04; C08F2/18; C08F220/06; C08F220/46; C08J9/20
Domestic Patent References:
JP2006002133A | 2006-01-05 | |||
JP2006002134A | 2006-01-05 | |||
JP2006045532A | 2006-02-16 | |||
JP2006282899A | 2006-10-19 |
Foreign References:
WO2004058910A1 | 2004-07-15 | |||
WO2003099955A1 | 2003-12-04 | |||
WO2007049616A1 | 2007-05-03 | |||
WO2007046273A1 | 2007-04-26 |
Attorney, Agent or Firm:
Kaoru Watanabe
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