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Title:
熱インプリント方法
Document Type and Number:
Japanese Patent JP5331315
Kind Code:
B2
Abstract:
There are provided a thermal-imprinting resin which has a good heat-deterioration tolerability and a low resin elastic modulus at the time of fluidization in order to suppress any production of particle-like materials in microfabrication by thermal imprinting, and has a good fine-pattern transfer characteristic, a thermal-imprinting-resin solution using the same, a thermal-imprinting injection-molded body using the same, a thermal-imprinting thin film using the same and a production method thereof. The thermal-imprinting resin has an exothermic onset temperature (oxidation onset temperature) of an exothermic peak due to oxidation greater than or equal to + 35 °C to the glass transition temperature of the resin in differential scanning calorimetric measurement at a temperature rise rate of 5 °C/min in air, and has a complex modulus less than 0.24 MPa at the glass transition temperature of the resin + 35 °C in a dynamic viscoelastic modulus measurement at a frequency of 1 rad/sec in nitrogen stream. The thermal-imprinting-resin solution, the thermal-imprinting injection-molded body, the thermal-imprinting thin film and the production method thereof use the foregoing resin.

Inventors:
Takuro Satsuka
Yoshiteru Takaya
Takao Kusuura
Mitra Oneupon
Application Number:
JP2007176062A
Publication Date:
October 30, 2013
Filing Date:
July 04, 2007
Export Citation:
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Assignee:
Maruzen Petrochemical Co., Ltd.
scivax corporation
International Classes:
B29C59/02; C08F32/08
Domestic Patent References:
JP2006182011A
JP2005330465A
Foreign References:
WO2007066712A1
WO2007018287A1
WO2007037085A1
Attorney, Agent or Firm:
Okuda Ritsuji
Gocho Ryushi



 
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