Title:
HEAT INSULATING BOARD OF INDUCTION HEATING DEVICE
Document Type and Number:
Japanese Patent JP2002299020
Kind Code:
A
Abstract:
To provide a heat insulating board of an induction heating device which is hardly deformed or broken due to radiation heat from a heated material in induction heating.
The heat insulating board of the induction heating device is disposed inside an induction heating coil for shielding the radiation heat from a heated material carried into the induction heating coil. The heat insulating board has a highly heat conductive monolithic refractory, whose thermal conductivity is at least 5W/(m°C), and a cooling pipe enclosed in the monolithic refractory.
More Like This:
Inventors:
AMAGASA TOSHIAKI
KATSURA SHIGEFUMI
EGUCHI TOSHINOBU
KATSURA SHIGEFUMI
EGUCHI TOSHINOBU
Application Number:
JP2001098514A
Publication Date:
October 11, 2002
Filing Date:
March 30, 2001
Export Citation:
Assignee:
KAWASAKI STEEL CO
MITSUBISHI ELECTRIC CORP
MITSUBISHI ELECTRIC CORP
International Classes:
B21B45/00; C21D1/42; F27B9/06; F27D1/12; F27D5/00; H05B6/02; H05B6/10; C21D9/00; C21D9/46; F27B9/24; F27D1/00; F27D9/00; F27D11/06; F27D99/00; (IPC1-7): H05B6/10; C21D1/42; F27D1/12
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)
Previous Patent: HEATING ELEMENT HEAT-RETAINING TYPE INDUCTION HEATER
Next Patent: HEATING COIL FOR INDUCTION HEATING DEVICE
Next Patent: HEATING COIL FOR INDUCTION HEATING DEVICE