Title:
HEAT INSULATING FILM AND HEAT INSULATING COMPONENT
Document Type and Number:
Japanese Patent JP2023016540
Kind Code:
A
Abstract:
To provide a heat insulating film which, despite being provided with an inorganic compound layer, overcomes various problems that arise due to the occurrence of voids or microcracks in the inorganic compound layer.SOLUTION: A heat insulating film 10 formed on at least a portion of the surface of a component 2 to be heat-insulated is formed from: an inorganic compound layer 20 in which scaly inorganic particles 22 are dispersed in an inorganic compound 21 formed from an alkoxide; and a top coat 30 that is formed on the inorganic compound layer 20, has a thickness of 0.5-30 μm, and is formed with an organic-inorganic hybrid material comprising a mixture of a metal alkoxide and a resin. By the formation of the top coat 30, voids 23 or microcracks in the inorganic compound layer 20 are filled with the organic/inorganic hybrid material, and the surface of the inorganic compound layer 20 is covered, so that the heat insulating performance of the heat insulating film 10 is enhanced, and fuel efficiency of an engine is improved by forming the heat insulating film 10 on piston top surfaces of the engine.SELECTED DRAWING: Figure 1
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Inventors:
YAMANOI RYOKO
YAMAKAWA NAOKI
TAGUCHI YOSUKE
MIYAMOTO KEISHI
YAMAKAWA NAOKI
TAGUCHI YOSUKE
MIYAMOTO KEISHI
Application Number:
JP2021120920A
Publication Date:
February 02, 2023
Filing Date:
July 21, 2021
Export Citation:
Assignee:
ART METAL MFG CO LTD
AISHIN KK
ACROSS CO
AISHIN KK
ACROSS CO
International Classes:
B32B9/00; B32B7/027; C23C28/00; F02F3/10; F16J9/26
Attorney, Agent or Firm:
Ogura Patent Office