Title:
HEAT-INSULATING FOUNDATION STRUCTURE
Document Type and Number:
Japanese Patent JP2010070967
Kind Code:
A
Abstract:
To prevent cracking in a finished layer 5 of a heat-insulating foundation structure which has a synthetic resin-foamed plate 4 annexed onto an external surface of a rising portion 2 of a foundation 1 of a building, and which has the finished layer 5 formed of a wet finishing material on the outer surface of the synthetic resin-foamed plate 4.
This heat-insulating foundation structure uses the synthetic resin-foamed plate 4 without having any skin layer and furthermore the finished layer 5 has flexibility with an elongation of 1-3 mm in a zero-span tension test, and a moisture permeance equal to/higher than that of the synthetic resin-foamed plate 4.
Inventors:
KIMURA YOSHIHARU
IMADA KATSUHITO
WAKABAYASHI MASAYUKI
MORIMOTO MIKIKO
IMADA KATSUHITO
WAKABAYASHI MASAYUKI
MORIMOTO MIKIKO
Application Number:
JP2008238847A
Publication Date:
April 02, 2010
Filing Date:
September 18, 2008
Export Citation:
Assignee:
DOW KAKO KK
FUJIKAWA KENZAI KOGYO KK
FUJIKAWA KENZAI KOGYO KK
International Classes:
E02D27/01
Domestic Patent References:
| JP2007146412A | 2007-06-14 | |||
| JP2003328371A | 2003-11-19 | |||
| JPS5280358A | 1977-07-06 | |||
| JP2006207114A | 2006-08-10 | |||
| JPH08177136A | 1996-07-09 | |||
| JP2008144370A | 2008-06-26 |
Attorney, Agent or Firm:
Keisuke Watanabe
Yoshihiro Yamaguchi
Yoshihiro Yamaguchi