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Title:
HEAT INSULATING MATERIAL FOR REFORMER
Document Type and Number:
Japanese Patent JP2008164078
Kind Code:
A
Abstract:

To provide a heat insulating material for a reformer obtaining heat insulating performance equivalent to or higher than conventional one even if thinned in wall thickness.

The heat insulating material for the reformer is provided surrounding the reformer and formed of a molding containing 58-87 mass% of fumed silica, 3-12 mass% of inorganic fiber and 10-30 mass% of inorganic powder with an average grain diameter of 1-50 m without containing an inorganic binder and an organic binder, and orienting the inorganic fiber orthogonally to the transfer direction of heat. The molding is processed and molded by a dry process.


Inventors:
ITO YASUO
NAKAMA SHIGERU
ABE ISAMI
IRIMURA JUNICHI
NAITO MAKIO
ABE HIROYA
Application Number:
JP2006355038A
Publication Date:
July 17, 2008
Filing Date:
December 28, 2006
Export Citation:
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Assignee:
NICHIAS CORP
International Classes:
F16L59/02; C01B3/38; H01M8/06; H01M8/10
Domestic Patent References:
JPH06137485A1994-05-17
JPS60208696A1985-10-21
JP2002161994A2002-06-07
JP2005083463A2005-03-31
JPH05194008A1993-08-03
JPH03247576A1991-11-05
JPH02199077A1990-08-07
JP2005081495A2005-03-31
JP2004081382A2004-03-18
JP2004182528A2004-07-02
JP2005061611A2005-03-10
JP2005335982A2005-12-08
JP2002106784A2002-04-10
JP2004353128A2004-12-16
JP2005329592A2005-12-02
JP2005289655A2005-10-20
JPH07103955B21995-11-08
JP2006307921A2006-11-09
JP2006161972A2006-06-22
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa



 
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