Title:
HEAT INSULATING MATERIAL
Document Type and Number:
Japanese Patent JP2012041956
Kind Code:
A
Abstract:
To provide a heat insulating material in which the occurrence of molding defects is suppressed and which has low bulk density.
The heat insulating material includes a plurality of small particles S composed of a first inorganic compound containing silica and having specific gravity of CS, a plurality of large particles L composed of a second inorganic compound, having specific gravity of CL, which is 3 or below, and having particle sizes larger than the small particles S, and an inorganic fiber F having average thickness of 1 μm to 20 μm, and a ratio MS/ML of a total value MS of mass of the plurality of small particles S to a total value ML of mass of the plurality of large particles L is 0.092 to 3 CS/CL.
Inventors:
NIINO HIDEAKI
Application Number:
JP2010181704A
Publication Date:
March 01, 2012
Filing Date:
August 16, 2010
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
B82B1/00; F16L59/02
Domestic Patent References:
| JPH04108677A | 1992-04-09 | |||
| JP2005081495A | 2005-03-31 | |||
| JP2008164078A | 2008-07-17 | |||
| JP2007153655A | 2007-06-21 | |||
| JP2007197870A | 2007-08-09 | |||
| JP2008239458A | 2008-10-09 | |||
| JP2009299893A | 2009-12-24 |
Foreign References:
| US20050100728A1 | 2005-05-12 | |||
| WO2006081066A2 | 2006-08-03 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Nishimoto
Yoshinori Shimizu
Hiroyuki Nishimoto