Title:
HEAT INSULATING PANEL
Document Type and Number:
Japanese Patent JP2014167371
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulating panel capable of improving workability while suppressing deterioration of heat insulating performance.SOLUTION: A heat insulating panel 10 includes a flat plate-shaped panel body 20, and a heat insulating body 30 sealed inside the panel body 20, and the heat insulating body 30 is formed by filling a plurality of heat insulating containers 40 having a core material S made of a low heat conductive material in the panel body 20. The heat insulating container 40 is preferably evacuated by reducing inside pressure. The heat insulating container 40 is preferably spherical. Further, a ratio of an outside diameter D1 of the heat insulating container 40 with respect to a thickness L of the panel body 20 is preferably 0.46 or less.
Inventors:
KITADE YUJIRO
TAKANO YUKIHIRO
TAKANO YUKIHIRO
Application Number:
JP2013039397A
Publication Date:
September 11, 2014
Filing Date:
February 28, 2013
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
F25D23/06; E04B1/76; E04B1/80; F16L59/06
Attorney, Agent or Firm:
Hiroaki Sakai
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