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Title:
HEAT INSULATING PANEL
Document Type and Number:
Japanese Patent JPH11181953
Kind Code:
A
Abstract:

To provide a heat insulating panel of excellent executability and workability by arranging a heat insulating member on a base plate integrated with an upper layer and a lower layer of which the main components are mineral fiber and inorganic powder body and a middle layer of which the main component is an inorganic foaming body.

A middle layer part 6 in which the main component is an inorganic foaming body and binder is added thereto, is arranged between an upper layer part 7 and a lower layer part 8 in which the main component is mineral fiber and an inorganic powder body and binder is added thereto, and they are integrated in layers to provide a base plate 5. Surface material 3 is arranged on the whole surface of a heat insulating layer 2, back material 4 is arranged on the whole back face, and hence a heat insulating member 1 is provided. The heat insulating member 1 is arranged on the fixed range of at least one face of the base plate 5, and hence a heat insulating panel A is constituted. Hereby the heat insulating panel A which while forming the heat insulating layer on a building, contributes to improvement of bearing force, earthquake resistance, high durability, fireproofing, and fire resistance, is easy in manufacture, and excellent in executability and workabikity, can be provided.


Inventors:
ISHIKAWA TAKASHI
Application Number:
JP34890497A
Publication Date:
July 06, 1999
Filing Date:
December 18, 1997
Export Citation:
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Assignee:
IG TECH RES INC
International Classes:
E04B1/80; B32B5/18; B32B9/00; B32B13/12; E04C2/26; (IPC1-7): E04C2/26; B32B5/18; B32B9/00; B32B13/12; E04B1/80



 
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