Title:
HEAT INSULATING STRUCTURE FOR BUILDING AND BUILDING HAVING THE SAME
Document Type and Number:
Japanese Patent JP3865218
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulating structure for a building and the building therewith causing no dew condensation in an entrance and its periphery on the inside of the building.
SOLUTION: This heat insulating structure is used for the building in which a foundation heat insulating material 2 is tightly brought into contact with an outer peripheral face 1a of a mat foundation 1 while an entrance porch 4 is constructed on a porch slab 3 protruded on the outer peripheral face 1a of the mat foundation 1. In the corner angle part 5 between the porch slab 3 and the foundation heat insulating material 2 on the porch slab 3, a porch heat insulating material 6 is arranged. A slab heat insulating material 18 is brought into tight contact with the lower side of the porch heat insulating material 6 at least on the outer peripheral face 3 of the porch slab 3. The outer peripheral face 18a of the slab heat insulating material 18 is covered with a mesh sheet 2 for the slab, while at least a lower end 20d of the mesh sheet 20 is installed to the porch slab 3.
Inventors:
Koji Imanishi
Shuya Ozeki
Takahashi Shigenobu
Shuya Ozeki
Takahashi Shigenobu
Application Number:
JP2001398973A
Publication Date:
January 10, 2007
Filing Date:
December 28, 2001
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
E04B1/76; E04B1/72; (IPC1-7): E04B1/76; E04B1/72
Domestic Patent References:
| JP2001081788A | ||||
| JP8209713A | ||||
| JP10266373A |
Attorney, Agent or Firm:
Mitsuhiko Watanabe