Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT INSULATING SUBSTRATE MATERIAL AND HEAT INSULATING EXTERIOR STRUCTURE
Document Type and Number:
Japanese Patent JP2006316452
Kind Code:
A
Abstract:

To provide a heat insulating substrate capable of eliminating the spattering thereof during construction, having excellent usability, and easily recyclable (classified collection) and a heat insulating exterior structure excellent in all of construction efficiency, heat insulation, weathering property, and recyclability.

This heat insulating substrate material 1 disposed between a building skeleton 2 and an exterior material 3 comprises an overlapping part 1f and an overlapped part 1d allowed to overlap with each other along both side edges in a flow direction and/or a ridge direction. One to a plurality of fitting parts 1k in independent projected shape are formed at either of the overlapping part 1f and the overlapped part 1d, and a fitted part 1i to which the fitting part 1k can be fitted is formed at the other. In the heat insulating exterior structure using the heat insulating substrate material 1, the heat insulating substrate materials 1 are connected to each other by fitting the adjacent fitting part 1k of the heat insulating substrate material 1 to the fitted part 1i of the heat insulating substrate material 1 on the building skeleton 2 and an exterior materials 3 are laid on the heat insulating substrate materials 1 connected to each other.


Inventors:
NISHIZAWA KAZUYUKI
KITAMURA KOICHI
SHODA TEPPEI
Application Number:
JP2005138505A
Publication Date:
November 24, 2006
Filing Date:
May 11, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
GANTAN BEAUTY KOGYO KK
International Classes:
E04D3/00; E04B1/61; E04B1/80; E04D3/35
Domestic Patent References:
JP2003082785A2003-03-19
JPH102071A1998-01-06
JPS52148513U1977-11-10
JPH116220A1999-01-12
Attorney, Agent or Firm:
Sadayuki Hosoi
Mitsuo Chonan
Ishiwatari Eibo
Nakamura Masamichi



 
Previous Patent: SWING STOPPING MECHANISM

Next Patent: GUIDE MECHANISM