Title:
HEAT-INSULATING SUPPORT FOR HIGH-DENSITY POLYSTYLENE FOAM PIPING
Document Type and Number:
Japanese Patent JP3692498
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat-insulating support for cold water piping or cold/hot water piping to prevent dew condensation by winding a dampproofing material layer with no use of any receptacle frame of M-shape whereby it is practicable to reduce the material cost and work execution costs of the heat-insulating support to the piping having a large bore.
SOLUTION: In the position of the heat-insulating support, a heat-insulating ring equipped with a pedestal and made of high-density polystylene foam having a density of approximately 100-200 kg/m3 is fitted on the periphery of the piping. A warm-keeping cylinder is installed adjacent to the heat-insulating ring, and the center of the ring is grasped by a clamp in the form of a circular arc. The dampproofing material layer is wound over the range from the periphery of the warm-keeping cylinder to that of the ring. The ring ends about the axial direction are shaped cylindrical while the intermediate part is shaped as a pedestal having flat end faces.
Inventors:
Kondo Yasushi
Akira Takasaki
Akira Takasaki
Application Number:
JP2000116290A
Publication Date:
September 07, 2005
Filing Date:
April 18, 2000
Export Citation:
Assignee:
Shinryo Corporation
Dia Chemical Co., Ltd.
Dia Chemical Co., Ltd.
International Classes:
F16L3/00; (IPC1-7): F16L3/00
Domestic Patent References:
| JP61200972U | ||||
| JP2756774B2 | ||||
| JP11118092A | ||||
| JP2001082684A | ||||
| JP1163273U | ||||
| JP11141746A |
Attorney, Agent or Firm:
Masataka Ninomiya