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Title:
HEAT-INSULATING WATERPROOF STRUCTURE AND HEAT-INSULATION WATERPROOFING METHOD
Document Type and Number:
Japanese Patent JP2010150800
Kind Code:
A
Abstract:

To provide a heat-insulating waterproof structure and a heat-insulation waterproofing method for a structure, in which a resin foam body having superior heat resistance is used.

This heat-insulating waterproof structure 1 includes a heat-insulation material 3 laminated on the substrate 2 of the structure, a fixing metal fitting 4 which has a thermally adhesive material on the surface exposed to the front surface of the heat-insulation material 3 and which is anchored to the substrate 2 to fix the heat-insulation material to the substrate 2, and a vinyl chloride resin sheet 5 which is laminated on the heat-insulation material 3 and adhered to the fixing metal fitting 4 through the thermally adhesive material. The thermally adhesive material 3 is formed by foaming a resin composition which contains a copolymer comprising aromatic vinyl units and aliphatic carboxylic acid derivative units.

COPYRIGHT: (C)2010,JPO&INPIT


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Inventors:
KUMAGAI TATSUO
KOBAYASHI HIROSHI
SATO TAKEISHI
TATEYAMA AI
Application Number:
JP2008329600A
Publication Date:
July 08, 2010
Filing Date:
December 25, 2008
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
E04D5/10; E04D5/14; E04D11/00
Domestic Patent References:
JP2008133666A2008-06-12
JP2008174910A2008-07-31
JPH11336268A1999-12-07
JP2006282962A2006-10-19
JP2007284634A2007-11-01