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Patent Searching and Data


Title:
HEAT INSULATION COVER OF VALVE DEVICE
Document Type and Number:
Japanese Patent JP2017032130
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat insulation cover of a valve device capable of improving mountability to a valve housing, while expanding a heat insulation temperature range.SOLUTION: A heat insulation cover 10 is mounted on a cap of a valve housing of a ventilation valve, and comprises a peripheral wall 11 and a top wall 18 formed at one end of the peripheral wall 11. An opening end part 12 of the peripheral wall 11 comprises a folded part 13 having a shape of being folded to an inner peripheral side. At the opening end part 12 of the peripheral wall 11, formed is a notch groove 19 transecting an inner peripheral edge 14 of the folded part 13 in a circumferential direction.SELECTED DRAWING: Figure 1

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Inventors:
HORI KEITA
Application Number:
JP2015155961A
Publication Date:
February 09, 2017
Filing Date:
August 06, 2015
Export Citation:
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Assignee:
ONDA SEISAKUSHO:KK
International Classes:
F16K27/12
Domestic Patent References:
JPS5814363U1983-01-28
JP2003287150A2003-10-10
JP2009174145A2009-08-06
JPS54149018A1979-11-21
JPS4814323Y11973-04-19
JPH04106254U1992-09-14
JPH0266447U1990-05-18
JP2009012862A2009-01-22
JP2010255763A2010-11-11
JPS4933046U1974-03-23
JPS60169146U1985-11-09
Foreign References:
US2772013A1956-11-27
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda