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Patent Searching and Data


Title:
HEAT INSULATION MATERIAL AND HEAT INSULATION BODY USING THIS MATERIAL
Document Type and Number:
Japanese Patent JP2004347092
Kind Code:
A
Abstract:

To provide a superior heat insulation material for exhibiting high heat insulation performance even in an incomplete moistureproof environment, and manufacturable by a relatively simple method.

This heat insulation material uses silica having physical properties of (a) the pore volume of 1.6 ml/g or more, (b) the moisture content of 15 wt% or less, and (c) the whole carbon concentration of 0.1 wt% to 15 wt%.


Inventors:
MORI HIROSHI
KITAGAWA MICHINARI
Application Number:
JP2003147880A
Publication Date:
December 09, 2004
Filing Date:
May 26, 2003
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
F16L59/00; C01B33/159; (IPC1-7): F16L59/00
Attorney, Agent or Firm:
Yu Sanada